Applied and Integrated Photonics

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The group is engaged in the use of progressive photonic technologies for the development and production of highly integrated and intelligent devices in the field of integrated photonics, spectroscopy and imaging systems.

NEW TECHNOLOGIES IN HYPERSPECTRAL IMAGING

Design of photonic elements and integration of photonic elements into innovative imaging and spectroscopic optical systems.

We develop highly integrated photonic elements based on micro-optics and meta-optics for light transformation in the optical systems of imaging systems, classical and imaging spectrometers, and special photonic chips for studying the mechanical behavior of micro-objects in strongly focused light fields.

Hyperspectral recording of the internal structure of the alga Trachydiscus minutus and processing of spectra into individual classes using artificial intelligence methods.

SINGLE AND TWO-PHOTON LITHOGRAPHY

Development of a robust technology for the production of photonic elements.

Development of specialized devices and technology for recording high details (100 nm and less) with subsequent copying of the matrix to the substrate by deep reactive ion etching technology. We are intensively developing technologies for maskless recording of micro-optical elements with a two-photon stereolithography of our own design and fs laser-assisted reactive ion etching.

Optical fiber holders fabricated by two-photon stereolithography for optical levitation under reduced pressure.

APPLIED AND INTEGRATED PHOTONICS

• Compact optical tweezers system with MEMS steering optics and optomechanics for biomedical applications.
• The use of photolithographic methods, wet and dry etching to produce optical elements, microfluidics and metasurfaces.
• Microchip for optical trapping of micro-objects under low pressure.
• Metaoptics structures for aberration-free imaging and spectroscopy systems.
• Inspection by Scanning Probe Microscopy with emphasis on the surface topography of prepared nanostructures and films & coatings.
• Determination of mechanical properties such as elastic modulus, hardness or film adhesion by nanoindentation measurements and scratch testing.
• Microfluidic acoustic wave based sorting chips.
• Arbitrary shaped optical gratings and micro-optical elements.