02468nas a2200217   4500008004100000022001400041245011300055210006900168300001100237490000700248520179100255653000802046653000702054100002102061700001902082700001902101700002002120700001902140700001902159856007202178       2026                        eng d  a2468-233000aMicro-compression analysis of biopolymer-producing bacteria using Cupriavidus necator as the model bacterium0 aMicrocompression analysis of biopolymerproducing bacteria using   a1001710 v153 a<p>With the development of highly sensitive experimental techniques, the mechanical properties of bacterial cells have become an important research topic. However, existing models used to fit experimental data from micro-compression tests often lack accuracy. The aim of this study was to address this limitation by developing a new curve-fitting mathematical model for evaluating the mechanical properties of rod-shaped bacterial cells. The proposed model is based on a thin-shell approach and is specifically designed for the interpretation of single-cell micro-compression experiments. To verify the applicability of the model, single-cell micro-compression tests were performed using a flat-punch nanoindenter tip larger than the bacterial cells. Atomic force microscopy (AFM) was used to obtain detailed morphological information, including precise cell dimensions required for curve fitting. As a model organism, the polyhydroxyalkanoate-producing bacterium Cupriavidus necator H16 was selected due to its ability to accumulate intracellular polyhydroxybutyrate (PHB) granules. For comparison, a mutant strain, C. necator PHB−4, which lacks PHB production, was also analyzed. The results showed that C. necator H16 cells, with an average PHB content of 72% of dry cell weight, exhibited a Young's modulus approximately 16× higher than that of the PHB−4 mutant, indicating a substantial contribution of intracellular PHB granules to cell stiffness. AFM analysis further revealed that PHB-producing cells were, on average, larger in volume than the non-producing mutant. The combination of AFM and micro-compression testing enabled comprehensive characterization of bacterial cell mechanics and demonstrated a clear correlation between PHB content and mechanical behaviour.</p>10aAIF10aMF1 aKhyrova, Marketa1 aSepitka, Josef1 aCerny, Vojtech1 aLukes, Jaroslav1 aSlaninova, Eva1 aPlichta, Tomas  uhttps://www.sciencedirect.com/science/article/pii/S246823302600004600816nas a2200277   4500008004100000022002500041245009700066210006900163300001600232490000700248653000800255653000700263653000700270653000700277100001800284700002500302700002100327700002400348700002000372700001600392700001800408700002000426700002000446700001400466856005800480       2026                        eng d  a1530-6984, 1530-699200aOptomechanical Probes with Tailored Material and Shape Asymmetry Assembled Using DNA Origami0 aOptomechanical Probes with Tailored Material and Shape Asymmetry  a2080–20880 v2610aAIF10aBF10aLF10aMF1 aRuiz-Arce, DD1 aBenešová, Markéta1 aProtiva, Václav1 aKočišek, Jaroslav1 aPilát, Zdeněk1 aJežek, Jan1 aSilhan, Lukas1 aZemánek, Pavel1 aJonas, Alexandr1 aSala, Leo  uhttps://pubs.acs.org/doi/10.1021/acs.nanolett.5c0535401722nas a2200217   4500008004100000022001400041245014700055210006900202300001100271520098900282653000801271653000701279100002301286700001801309700001901327700001901346700002901365700001901394700001901413856007201432       2026                        eng d  a0169-433200aOxidation resistance of organosilicon layered nanostructures synthesized by nonthermal plasma and plasma silica as a source of oxidizing agent0 aOxidation resistance of organosilicon layered nanostructures syn  a1649723 a<p>Plasma polymer (1.2 g cm−3), compact silicon carbide (2.1 g cm−3) and plasma silica (2.2 g cm−3) were synthesized from pure tetravinylsilane vapor or its mixture with argon or oxygen by plasma-enhanced chemical vapor deposition. These materials in the form of nanolayers were combined into layered nanostructures deposited on silicon wafers. XPS depth profiling was used to analyze the chemical depth profiles across the layered nanostructures. The oxidation resistance of highly cross-linked silicon carbide and plasma silica was confirmed after 18 months of storage. However, the plasma polymer with low oxidation resistance must be protected by a 5-nm thick compact silicon carbide barrier to prevent its oxidation. Plasma silica was identified as the source of oxidizing agent for the adjacent plasma polymer in the silica/polymer nanostructure protected by a barrier against the surrounding environment. Oxygen penetrated the polymer by 37 nm in two years.</p>10aAIF10aMF1 aBránecký, Martin1 aJiricek, Petr1 aHoudkova, Jana1 aOlivova, Lucie1 aAboualigaledari, Naghmeh1 aPlichta, Tomas1 aCech, Vladimir  uhttps://www.sciencedirect.com/science/article/pii/S016943322502688102013nas a2200229   4500008004100000022001400041245010000055210006900155260000700224300001100231490000700242520136200249653000801611653000701619100001801626700002301644700002101667700002001688700001701708700002001725856003801745       2025                        eng d  a2166-274600aCompact vacuum setup for laser induced plasma etching with optical emission spectrum monitoring0 aCompact vacuum setup for laser induced plasma etching with optic  c04  a0342020 v433 a<p>Reactive ion etching and reactive ion beam etching are widely used processes in the semiconductor industry but face challenges due to their high cost, energy demands, and maintenance complexity. Femtosecond laser micromachining has emerged as a versatile and precise method for microfabrication, but it often results in suboptimal surface quality, which requires postprocessing. Laser-induced plasma etching (LIPE) presents a promising solution, achieving low surface roughness and efficient material removal rates. Here, we investigate the LIPE process by utilizing a femtosecond laser setup with optimized optical components and a custom-designed compact vacuum chamber, enabling precise control and monitoring of the reactive gas environment for plasma generation and etching. The effects of numerical aperture, working distance, and laser energy thresholds on plasma ignition and plume formation were examined. Preliminary results demonstrate plasma ignition in air and SF6 gas with laser pulse energy thresholds between 15 and 20 μJ using a 10× magnification microscope objective. The spectral analysis of the plasma generated in the SF6 gas provides insights into plasma dynamics and enables real-time process monitoring. This work establishes foundational parameters for optimizing LIPE setups and advancing precision etching applications.</p>10aAIF10aMF1 aSilhan, Lukas1 aArregi, Jon, Ander1 aPlichta, Tomáš1 aVaculik, Ondrej1 aNovotny, Jan1 aŠerý, Mojmír  uhttps://doi.org/10.1116/6.000429601392nas a2200205   4500008004100000022001400041245008800055210006900143300000800212490000700220520079100227653000801018653000701026100002601033700002201059700002001081700002001101700002101121856004401142       2025                        eng d  a2310-286100aImpact of Collagen on the Rheological and Transport Properties of Agarose Hydrogels0 aImpact of Collagen on the Rheological and Transport Properties o  a3960 v113 a<p>This work investigated how collagen addition affects the rheological and transport properties of agarose hydrogels. Collagen did not affect the rheological character of hydrogels (i.e., the overall shape of amplitude and frequency response curves) but changed their viscoelastic moduli and mesh size dependent on the concentration of both constituents. The diffusion coefficients of the oppositely charged model dyes eosin B and methylene blue were determined in all hydrogels and demonstrated a profound effect of electrostatic interactions. Comparison with similar work with fibroin addition showed that while the effects of these proteins on the viscoelastic properties of a polysaccharide network can be similar, their impact on network transport properties may be different.</p>10aAIF10aMF1 aRichterová, Veronika1 aGjevik, Alžběta1 aVaculik, Ondrej1 aVejrosta, Jakub1 aPekař, Miloslav  uhttps://www.mdpi.com/2310-2861/11/6/39602139nas a2200217   4500008004100000022001400041245010000055210006900155300001100224490000800235520146500243653000801708653000701716100001901723700002201742700002501764700002101789700002001810700001901830856007201849       2025                        eng d  a0141-813000aMultiscale analysis of mechanical and structural properties of agarose–silk fibroin hydrogels0 aMultiscale analysis of mechanical and structural properties of a  a1481330 v3303 a<p>This study provides a comprehensive characterization of the agarose–silk fibroin hydrogels, using atomic force microscopy and scanning transmission electron microscopy to analyse their structure and assess the effect of composition on mechanical properties via nanoindentation and rheological analysis. These measurements enabled determination of mechanical properties, including the elastic and viscoelastic moduli at both the micro- and macroscale. The hydrogels exhibited a wide range of moduli depending on different degrees of network crosslinking, influenced by varying concentrations of agarose (1 or 2&nbsp;wt%) and the percentage of fibroin fibres (0–4.5&nbsp;wt%) as an interpenetrating component. The viscoelastic modulus (G') and the elastic modulus determined using a relaxation model (E), were 5–57&nbsp;kPa and 1.2–110&nbsp;kPa, respectively. The adhesion energy of these hydrogels was determined from nanoindentation curves and analysed using the JKR model, with values ranging from 0.031 to 0.066&nbsp;J&nbsp;m−2. These results provide insight into how the hydrogels' microstructure influences their mechanical and transport properties. Incorporating fibroin into these gels modifies biological and biochemical characteristics of the gels, suggesting that such composite hydrogels could be further explored for potential applications in controlled release systems, extracellular matrix models, or tissue engineering scaffolds.</p>10aAIF10aMF1 aPlichta, Tomas1 aMrazova, Katerina1 aRichterova, Veronika1 aKhyrova, Marketa1 aLukes, Jaroslav1 aSepitka, Josef  uhttps://www.sciencedirect.com/science/article/pii/S014181302508690800707nas a2200229   4500008004100000245008700041210006900128260005100197653000800248653000700256100001700263700001800280700001600298700001500314700001500329700001400344700001700358700001900375700002000394700002400414856003900438       2025                        eng d00aPreparation and pilot experiments on microfluidic chip with surface acoustic waves0 aPreparation and pilot experiments on microfluidic chip with surf  bInternational Society for Optics and Photonics10aAIF10aMF1 aVejrosta, J.1 aCabalová, S.1 aPlichta, T.1 aŠerý, M.1 aMaňka, T.1 aSamek, O.1 aZemánek, P.1 aPudiš, Dušan1 aJandura, Daniel1 aLettrichová, Ivana  uhttps://doi.org/10.1117/12.305674002426nas a2200253   4500008004100000022001400041245013900055210006900194300001100263490000700274520162900281653000801910653000701918100001901925700002101944700002101965700001901986700002202005700001602027700001902043700002002062700001802082856007202100       2025                        eng d  a2590-007200aStability of masking materials for pattern transfer of lithographic masks into fused silica by atmospheric pressure plasma jet etching0 aStability of masking materials for pattern transfer of lithograp  a1003090 v283 a<p>Masking of thin films and bulk materials is traditionally applied for the transfer of micron patterns into the functional material according to the requirements of the application. For optical purposes, lithographically produced micron patterns are transferred by plasma/ion etching, which is a traditional technology in microelectronics and other micron technologies. However, pattern transfer by atmospheric pressure plasma etching can help to save time and cost for a future sustainable production. Therefore, the pattern transfer of lithographic resist masks into fused silica using atmospheric pressure reactive plasma jets (APPJ) was studied as a new approach of micropatterning. First the etch rates of the potential masking materials, e.g. photoresists, as well as of fused silica as substrate are studied in dependence on the APPJ etching parameters, in particular on the gas composition (O2/CF4) and the dwell time of the APPJ tool's footprint. Typical etch rates of the masking materials are in the range of 140 to 370&nbsp;nm·s−1 whereas the fused silica has a rate of 25 to 80&nbsp;nm·s−1. The surface morphology of masking materials changes during etching and features additional nanoscale roughness and waviness. The surface roughness of the etched masking materials and the fused silica are 2 to 5&nbsp;nm rms and 1.5&nbsp;nm rms for etch depths of ∼3000&nbsp;nm and&nbsp;∼&nbsp;600&nbsp;nm, respectively. Finally, the pattern transfer by APPJ of a diffraction grating with a period of 15&nbsp;μm, depth of 230&nbsp;nm and a roughness below 2&nbsp;nm rms into fused silica was demonstrated.</p>10aAIF10aMF1 aHeinke, Robert1 aŠilhan, Lukáš1 aEhrhardt, Martin1 aLorenz, Pierre1 aZajadacz, Joachim1 aBauer, Jens1 aArnold, Thomas1 aŠerý, Mojmír1 aZimmer, Klaus  uhttps://www.sciencedirect.com/science/article/pii/S259000722500015200511nas a2200169   4500008004100000245005300041210005300094653000800147653000700155100001800162700001700180700002100197700001600218700002000234700002000254856006700274       2024                        eng d00aDesign of Setup for Laser Induced Plasma Etching0 aDesign of Setup for Laser Induced Plasma Etching10aAIF10aMF1 aSilhan, Lukas1 aNovotny, Jan1 aPlichta, Tomáš1 aJežek, Jan1 aVaculik, Ondrej1 aŠerý, Mojmír  uhttp://isibrno.cz/cs/design-setup-laser-induced-plasma-etching00675nas a2200181   4500008004100000020001800041245013100059210006900190250001100259260001000270300001400280653000800294653000700302100002100309700002100330700001900351856012300370       2024                        eng d  a978139423820000aFunctional Interlayers Developed to Control Interfacial Adhesion in Polymer Composites Reinforced with Glass and Basalt Fibers0 aFunctional Interlayers Developed to Control Interfacial Adhesion  aVol. 8  bWiley  a119–18810aAIF10aMF1 aPlichta, Tomáš1 aČech, Vladimír1 aMittal, K., L.  uhttp://isibrno.cz/cs/functional-interlayers-developed-control-interfacial-adhesion-polymer-composites-reinforced-glass01782nas a2200193   4500008004100000022001400041245011200055210006900167520117100236653000801407653000701415100002401422700001701446700001801463700002301481700001601504700002101520856004701541       2023                        eng d  a1433-301500aAnalysis of the machinability of different types of sintered carbides with WEDM in both water and oil baths0 aAnalysis of the machinability of different types of sintered car3 a<p>The unconventional wire electric discharge machining (WEDM) technology represents a vital manufacturing technology in different industrial branches. This technology is essential because of the possibility to machine difficult-to-machine materials such as sintered carbides. For this reason, this study analyses the machinability of sintered carbides WKP23S, WSM33S and WK1 with WEDM in both water and oil baths. We investigated the influence of the machining parameters, namely, pulse off time, gap voltage, discharge current, pulse on time and wire feed, on the cutting speed, surface roughness and defect occurrence. We investigated 9 different roughness parameters, analysed surface morphology with an electron microscope and also analysed cross-sectioned samples. We found out that machining sintered carbides in oil bath yields better results than machining in deionized water. The oil tank prevents the removal of the cobalt binder, but it does not reduce fissure occurrence in any significant way. The lowest Ra value, that is 0.7 µm, was recorded for the WKP23S sample when machined in oil and Ra 0.9 µm when the same material was machined in water.</p>10aAIF10aMF1 aMouralova, Katerina1 aBenes, Libor1 aProkes, Tomas1 aZahradnicek, Radim1 aFries, Jiri1 aPlichta, Tomáš  uhttps://doi.org/10.1007/s00170-023-10913-400840nas a2200277   4500008004100000245012000041210006900161260000800230300001600238490000700254653000800261653000700269653000700276653000700283100002200290700002300312700002700335700001500362700002100377700002400398700002000422700001900442700001800461700002000479856006300499       2023                        eng d00aRapid identification of pathogens in blood serum via Raman tweezers in combination with advanced processing methods0 aRapid identification of pathogens in blood serum via Raman tweez  cDec  a6410–64210 v1410aAIF10aBF10aLF10aMF1 aVaculík, Ondřej1 aBernatová, Silvie1 aRebrošová, Katarína1 aSamek, Ota1 aŠilhan, Lukáš1 ažička, Filip, Rů1 aŠerý, Mojmír1 aŠiler, Martin1 aek, Jan, Jež1 aZemánek, Pavel  uhttps://opg.optica.org/boe/abstract.cfm?URI=boe-14-12-641002580nas a2200193   4500008004100000022001400041245009200055210006900147300001100216490000800227520198700235653000802222653000702230100001902237700001702256700002202273700001902295856007202314       2023                        eng d  a0257-897200aStable a-CSi:H films with a wide range of modulus of elasticity and low internal stress0 aStable aCSiH films with a wide range of modulus of elasticity an  a1291470 v4593 a<p>Amorphous hydrogenated silicon carbide (a-CSi:H) thin films were deposited by plasma-enhanced chemical vapor deposition using tetravinylsilane as organosilicon precursor. The mechanical properties of the thin films, namely the modulus of elasticity, hardness, and elastic recovery parameter, were determined by nanoindentation, as well as the internal stresses by scanning electron microscopy and optical profilometry. It was found that the modulus of elasticity increased from 10 to 137&nbsp;GPa with increasing power (2–150&nbsp;W) delivered to plasma, while the hardness increased from 1.5 to 14.5&nbsp;GPa. This improvement in mechanical properties with increasing energy delivered to the plasma is related to greater fragmentation of the precursor which led to an increase in the crosslinking of the material network. The compressive internal stresses in the films reached low values of −0.04 to −0.2&nbsp;GPa with increasing power (2–75&nbsp;W) and an acceptable −0.5&nbsp;GPa for 150&nbsp;W. The elastic recovery parameter decreased with increasing power from 0.86 to 0.64, i.e., the thin films behaved more plasticity with increasing power. The modulus of elasticity and hardness were investigated in terms of the aging of the films for a period of 6&nbsp;years when samples were stored under ambient conditions. No significant changes in these properties were observed. However, minor changes were observed in the indentation curves obtained for the 2&nbsp;W and even less for the 10&nbsp;W samples. Small changes were then also observed for the elastic recovery parameter, whose value for these samples partially decreased which may be related to postdeposition oxidation. No changes in internal stress values over time were observed. The wide range of mechanical properties of stable a-CSi:H films with low internal stress increases their application potential and their wide use as materials with tailored properties from polymer-like to tough material.</p>10aAIF10aMF1 aPlichta, Tomas1 aSulc, Vaclav1 aOhlidal, Miloslav1 aCech, Vladimir  uhttps://www.sciencedirect.com/science/article/pii/S025789722201068401697nas a2200205   4500008004100000245008800041210006900129300001400198490000800212520109100220653000801311653000701319100002401326700001901350700002301369700001801392700001901410700001601429856004601445       2022                        eng d00aExperimental analysis of microhardness changes of subsurface areas affected by WEDM0 aExperimental analysis of microhardness changes of subsurface are  a1979-19910 v2363 a<p>The influence of the surface area by the impact of high temperatures after wire electric discharge machining (WEDM) is a known fact. However, the affected parameters also include a change in microhardness. In order to further investigate this statement, 5 different ferrous and non-ferrous materials were selected, from which three samples were always made with different settings of machine parameters (gap voltage, pulse on and off time, wire feed and discharge current). This examined not only the effect of the machining itself on the material but also whether the change in the microhardness of the material is affected by the setting of the machine parameters. In order to measure the microhardness of the subsurface layer, a metallographic preparation was made from each sample, which enabled accurate measurements always in the same area. Subsequent evaluation revealed that the microhardness may not be affected at all and everything depends only on the type of material being machined. The changes in microhardness affected by setting machine parameters are negligible.</p>10aAIF10aMF1 aMouralova, Katerina1 aMichna, Stefan1 aZahradnicek, Radim1 aBednar, Josef1 aPlichta, Tomas1 aFries, Jiri  uhttps://doi.org/10.1177/0954408922107838300639nas a2200217   4500008004100000022001400041245006500055210006500120260001100185300000900196490000700205653000800212653000700220100002400227700001800251700001700269700002100286700001800307700001600325856008000341       2022                        eng d  a2045-232200aProduction of precision slots in copper foil using micro EDM0 aProduction of precision slots in copper foil using micro EDM  cMAR 23  a50230 v1210aAIF10aMF1 aMouralova, Katerina1 aBednar, Josef1 aBenes, Libor1 aPlichta, Tomáš1 aProkes, Tomas1 aFries, Jiri  uhttp://isibrno.cz/cs/production-precision-slots-copper-foil-using-micro-edm02627nas a2200181   4500008004100000022001400041245005600055210005600111300001100167490000800178520211100186653000802297653000702305100001902312700002302331700001902354856007202373       2022                        eng d  a0040-609000aSurface topography affects the nanoindentation data0 aSurface topography affects the nanoindentation data  a1391050 v7453 a<p>The near-surface mechanical properties of thin films as well as bulk materials are amongst the key parameters important for their application, and instrumented nanoindentation is a standard technique for determining these mechanical properties. However, it is known that the surface topography of the characterized materials may affect the nanoindentation data when a sharp indenter for small penetration depths (displacements) is used. A thin film of hydrogenated amorphous silicon carbide with a thickness of 1.0&nbsp;μm was deposited on a silicon wafer by plasma-enhanced chemical vapour deposition. The cyclic nanoindentation was used to construct a depth profile of mechanical properties for the flat surface (0.5&nbsp;nm roughness) of the thin film, which made it possible to determine its modulus of elasticity of 83&nbsp;GPa and hardness of 8.6&nbsp;GPa unaffected by the silicon substrate. Grains with a spherical cap geometry with a typical radius of 0.5&nbsp;µm and a&nbsp;height of 60&nbsp;nm are distributed along the flat surface of the film. The grains have the same mechanical properties as the deposited film. Depth profiles of mechanical properties were determined for different types of contact between the Berkovich indenter with a radius of 50&nbsp;nm and the selected grain (grain top, grain foot, two or three grains); i.e. for these measurements the following applied - the radius of the tip curvature was less than grain radii (RBerkovich &lt; Rgrain). Residual imprints after nanoindentation measurements were carefully observed by atomic force microscopy and scanning electron microscopy. The near-surface mechanical properties were significantly affected by the surface topography, and the determined modulus of elasticity and hardness were crucially under- or overestimated in the range of 50% to 100% compared to the real values. The nature of these deviations was discussed. The solution is to use cyclic nanoindentation performed on the flat surfaces or on the top of grains, followed by extrapolation of the depth profiles to the zero-contact depth (film surface).</p>10aAIF10aMF1 aPlichta, Tomas1 aZahradnicek, Radim1 aCech, Vladimir  uhttps://www.sciencedirect.com/science/article/pii/S004060902200026802406nas a2200205   4500008004100000022001400041245009600055210006900151300000800220490000700228520179900235653000802034653000702042100002102049700002602070700001802096700002102114700002102135856004402156       2021                        eng d  a2073-436000aThe Adhesion of Plasma Nanocoatings Controls the Shear Properties of GF/Polyester Composite0 aAdhesion of Plasma Nanocoatings Controls the Shear Properties of  a5930 v133 a<p>High-performance fibre-reinforced polymer composites are important construction materials based not only on the specific properties of the reinforcing fibres and the flexible polymer matrix but also on the compatible properties of the composite interphase. First, oxygen-free (a-CSi:H) and oxygen-binding (a-CSiO:H) plasma nanocoatings of different mechanical and tribological properties were deposited on planar silicon dioxide substrates that closely mimic E-glass. The nanoscratch test was used to characterize the nanocoating adhesion expressed in terms of critical normal load and work of adhesion. Next, the same nanocoatings were deposited on E-glass fibres, which were used as reinforcements in the polyester composite to affect its interphase properties. The shear properties of the polymer composite were characterized by macro- and micromechanical tests, namely a short beam shear test to determine the short-beam strength and a single fibre push-out test to determine the interfacial shear strength. The results of the polymer composites showed a strong correlation between the short-beam strength and the interfacial shear strength, proving that both tests are sensitive to changes in fibre-matrix adhesion due to different surface modifications of glass fibres (GF). Finally, a strong correlation between the shear properties of the GF/polyester composite and the adhesion of the plasma nanocoating expressed through the work of adhesion was demonstrated. Thus, increasing the work of adhesion of plasma nanocoatings from 0.8 to 1.5 mJ·m−2 increased the short-beam strength from 23.1 to 45.2 MPa. The results confirmed that the work of adhesion is a more suitable parameter in characterising the level of nanocoating adhesion in comparison with the critical normal load.</p>10aAIF10aMF1 aPlichta, Tomáš1 aŠirjovová, Veronika1 aZvonek, Milan1 aKalinka, Gerhard1 aČech, Vladimír  uhttps://www.mdpi.com/2073-4360/13/4/593